{"title":"Industry Reports","description":"\u003cdiv style=\"font-size:1rem;line-height:1.7;color:#374151;\"\u003e\n\u003cp\u003e\u003cstrong\u003eWaveQuanta Intelligence\u003c\/strong\u003e publishes deep-dive strategic reports on emerging photonics and advanced-packaging technologies. Each report is a self-contained business intelligence resource — physics teardown, market reconciliation, regional player landscape, and an actionable investment \/ partner \/ buy \/ pass framework. Reports are delivered as PDF (single-licence) within one business day of purchase.\u003c\/p\u003e\n\u003c\/div\u003e","products":[{"product_id":"wq-report-tgv-glass-interconnect-stack-2026","title":"Through-Glass Vias \u0026 Glass-Core Substrates — The Glass Interconnect Stack (Strategic Intelligence Report 2026)","description":"\u003cdiv style=\"font-family:system-ui,-apple-system,sans-serif;color:#1f2937;line-height:1.7;\"\u003e\n\n\u003cp style=\"font-size:1rem;color:#374151;margin:0 0 18px 0;\"\u003e\nA first-principles map of the \u003cstrong\u003eThrough-Glass Via (TGV)\u003c\/strong\u003e technology chain, the global competitive landscape across \u003cstrong\u003e60+ players\u003c\/strong\u003e in the US, EU, Japan, Korea, China and Taiwan, and where economic value pools across the \u003cstrong\u003eeight industrial layers\u003c\/strong\u003e from glass blank to integrated module. Reconciled market models, regional player profiles, and an investment \/ partner \/ buy \/ pass decision framework — built for ultrafast-laser equipment vendors, fabless \/ IDM strategy teams, and tech-sector investors.\n\u003c\/p\u003e\n\n\u003cdiv style=\"margin:24px 0;padding:18px 22px;background:#fafafa;border-left:3px solid #1a7b9a;border-radius:6px;\"\u003e\n\u003cdiv style=\"display:flex;gap:28px;flex-wrap:wrap;font-size:0.94rem;\"\u003e\n\u003cdiv\u003e\n\u003cstrong style=\"font-size:1.25rem;color:#1a7b9a;\"\u003e67.2 %\u003c\/strong\u003e\u003cbr\u003e\u003cspan style=\"color:#6b7280;\"\u003eSEMI\/GNC glass-core CAGR 2028–2040 (avg)\u003c\/span\u003e\n\u003c\/div\u003e\n\u003cdiv\u003e\n\u003cstrong style=\"font-size:1.25rem;color:#1a7b9a;\"\u003e\u0026lt; 5 µm\u003c\/strong\u003e\u003cbr\u003e\u003cspan style=\"color:#6b7280;\"\u003eVia Ø reachable by ultrafast LIDE (AR 1:50)\u003c\/span\u003e\n\u003c\/div\u003e\n\u003cdiv\u003e\n\u003cstrong style=\"font-size:1.25rem;color:#1a7b9a;\"\u003e$175 M\u003c\/strong\u003e\u003cbr\u003e\u003cspan style=\"color:#6b7280;\"\u003eUS CHIPS to Absolics first merchant glass-core fab\u003c\/span\u003e\n\u003c\/div\u003e\n\u003cdiv\u003e\n\u003cstrong style=\"font-size:1.25rem;color:#1a7b9a;\"\u003e75–85 %\u003c\/strong\u003e\u003cbr\u003e\u003cspan style=\"color:#6b7280;\"\u003eReported glass-substrate yield (gating constraint)\u003c\/span\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\n\u003ch3 style=\"margin:28px 0 12px 0;font-size:1.1rem;color:#111827;\"\u003eReport Metadata\u003c\/h3\u003e\n\u003cul style=\"margin:0;padding-left:20px;color:#374151;font-size:0.94rem;\"\u003e\n\u003cli\u003e\n\u003cstrong\u003eReport ID:\u003c\/strong\u003e API-SEMI-2026-05 (supersedes API-SEMI-2026-04)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIssue date:\u003c\/strong\u003e 31 May 2026 · \u003cstrong\u003eKnowledge horizon:\u003c\/strong\u003e Q2 2026 public sources\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLength:\u003c\/strong\u003e 106 pages · 33 figures · 33 tables · 75+ referenced sources\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAnalytical lens:\u003c\/strong\u003e Ultrafast-laser via formation\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eClassification:\u003c\/strong\u003e Single-licence · Confidential\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3 style=\"margin:28px 0 12px 0;font-size:1.1rem;color:#111827;\"\u003eContents (12 sections, 4 parts)\u003c\/h3\u003e\n\u003cdiv style=\"font-size:0.94rem;color:#374151;\"\u003e\n\u003cp style=\"margin:8px 0;\"\u003e\u003cstrong\u003eFront Matter\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul style=\"margin:4px 0 14px 24px;\"\u003e\u003cli\u003e00 · Executive summary \u0026amp; key findings\u003c\/li\u003e\u003c\/ul\u003e\n\n\u003cp style=\"margin:8px 0;\"\u003e\u003cstrong\u003ePart I — Technology \u0026amp; Physics\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul style=\"margin:4px 0 14px 24px;\"\u003e\n\u003cli\u003e01 · What TGV is, and why physics favours glass\u003c\/li\u003e\n\u003cli\u003e02 · The full technology chain — eight layers\u003c\/li\u003e\n\u003cli\u003e02b · Via formation \u0026amp; the ultrafast-laser engine\u003c\/li\u003e\n\u003cli\u003e03 · End-to-end process flow \u0026amp; yield physics\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp style=\"margin:8px 0;\"\u003e\u003cstrong\u003ePart II — Market \u0026amp; Commercialization\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul style=\"margin:4px 0 14px 24px;\"\u003e\n\u003cli\u003e04 · Market models, reconciled by scope\u003c\/li\u003e\n\u003cli\u003e05 · Commercialization timeline \u0026amp; reality check\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp style=\"margin:8px 0;\"\u003e\u003cstrong\u003ePart III — Players by Region\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul style=\"margin:4px 0 14px 24px;\"\u003e\n\u003cli\u003e06 · Landscape overview \u0026amp; competitive tiers\u003c\/li\u003e\n\u003cli\u003e07 · United States \u0026amp; Europe\u003c\/li\u003e\n\u003cli\u003e08 · Japan · 09 · Korea\u003c\/li\u003e\n\u003cli\u003e10 · China — racing a full parallel chain\u003c\/li\u003e\n\u003cli\u003e10b · Taiwan — integration at foundry scale\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp style=\"margin:8px 0;\"\u003e\u003cstrong\u003ePart IV — Investment, Risk \u0026amp; Action\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul style=\"margin:4px 0 14px 24px;\"\u003e\n\u003cli\u003e11 · Capital, policy \u0026amp; the investment matrix\u003c\/li\u003e\n\u003cli\u003e12 · Risk, due diligence \u0026amp; the equipment-vendor playbook\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp style=\"margin:8px 0;\"\u003e\u003cstrong\u003eAppendices\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul style=\"margin:4px 0 14px 24px;\"\u003e\n\u003cli\u003eA · Patents, papers \u0026amp; glossary\u003c\/li\u003e\n\u003cli\u003eR · References (75 sources, hyperlinked)\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\n\u003ch3 style=\"margin:28px 0 12px 0;font-size:1.1rem;color:#111827;\"\u003eSelected Figures (33 total)\u003c\/h3\u003e\n\u003cul style=\"margin:0;padding-left:20px;color:#374151;font-size:0.9rem;columns:2;column-gap:30px;\"\u003e\n\u003cli\u003eF1 Indexed market scenarios 2026–2040\u003c\/li\u003e\n\u003cli\u003eF2 Technology-readiness heat-bar by sub-technology\u003c\/li\u003e\n\u003cli\u003eF3 TGV cross-section schematic — glass core as 3-D platform\u003c\/li\u003e\n\u003cli\u003eF4 Interconnect-density \/ cost \/ area trade space\u003c\/li\u003e\n\u003cli\u003eF5 Insertion loss vs frequency by substrate\u003c\/li\u003e\n\u003cli\u003eF6 CTE ladder — glass tunes silicon-to-board\u003c\/li\u003e\n\u003cli\u003eF7 The eight-layer TGV value chain\u003c\/li\u003e\n\u003cli\u003eF8 Value-pool share by layer — 2026 vs 2030\u003c\/li\u003e\n\u003cli\u003eF10 Via design space — Ø vs aspect ratio\u003c\/li\u003e\n\u003cli\u003eF11 LIDE two-step process — modify then etch\u003c\/li\u003e\n\u003cli\u003eF12 Throughput–quality frontier\u003c\/li\u003e\n\u003cli\u003eF13 Laser regime map for glass via formation\u003c\/li\u003e\n\u003cli\u003eF14 GHz-burst architecture\u003c\/li\u003e\n\u003cli\u003eF15 Ultrafast source positioning — power vs pulse regime\u003c\/li\u003e\n\u003cli\u003eF22 Representative TGV manufacturing sequence\u003c\/li\u003e\n\u003cli\u003eF25 Segment growth rates\u003c\/li\u003e\n\u003cli\u003eF26 Commercialization Gantt — who ramps when\u003c\/li\u003e\n\u003cli\u003eF28 Three-tier competitive positioning\u003c\/li\u003e\n\u003cli\u003eF29 China localisation heatmap by chain link\u003c\/li\u003e\n\u003cli\u003eF30 Capability radar — six player archetypes\u003c\/li\u003e\n\u003cli\u003eF32 Investment matrix — defensibility vs near-term revenue\u003c\/li\u003e\n\u003cli\u003eF33 Invest \/ partner \/ buy \/ pass — decision flow\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3 style=\"margin:28px 0 12px 0;font-size:1.1rem;color:#111827;\"\u003eSelected Tables (33 total)\u003c\/h3\u003e\n\u003cul style=\"margin:0;padding-left:20px;color:#374151;font-size:0.9rem;columns:2;column-gap:30px;\"\u003e\n\u003cli\u003eT3 Glass vs organic vs silicon — attribute ledger\u003c\/li\u003e\n\u003cli\u003eT5 The eight layers: function, players, constraint\u003c\/li\u003e\n\u003cli\u003eT7 Glass-blank suppliers and disclosed specs\u003c\/li\u003e\n\u003cli\u003eT8 Via-formation route matrix\u003c\/li\u003e\n\u003cli\u003eT9 Ultrafast laser-source \u0026amp; integrated-tool vendors\u003c\/li\u003e\n\u003cli\u003eT10 Metallisation \u0026amp; adhesion approaches\u003c\/li\u003e\n\u003cli\u003eT11 RDL line\/space roadmap and application fit\u003c\/li\u003e\n\u003cli\u003eT15 Process-step yield risk register\u003c\/li\u003e\n\u003cli\u003eT17 Indexed scenario outputs (2026–2040)\u003c\/li\u003e\n\u003cli\u003eT18 Commercialization milestones\u003c\/li\u003e\n\u003cli\u003eT19 Opportunity vs hype, by application\u003c\/li\u003e\n\u003cli\u003eT20 US \u0026amp; European players\u003c\/li\u003e\n\u003cli\u003eT21 Japanese players · T22 Korean players\u003c\/li\u003e\n\u003cli\u003eT23 Chinese players across the chain\u003c\/li\u003e\n\u003cli\u003eT24 China localisation by chain link\u003c\/li\u003e\n\u003cli\u003eT25 Taiwanese players\u003c\/li\u003e\n\u003cli\u003eT26 Capacity \u0026amp; funding snapshot\u003c\/li\u003e\n\u003cli\u003eT27 Government funding \u0026amp; policy by region\u003c\/li\u003e\n\u003cli\u003eT28 Investable subsectors ranked\u003c\/li\u003e\n\u003cli\u003eT29 Principal risks — likelihood \/ impact \/ mitigation\u003c\/li\u003e\n\u003cli\u003eT30 Due-diligence checklist\u003c\/li\u003e\n\u003cli\u003eT31 Representative patents \/ IP signposts\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cdiv style=\"margin-top:32px;padding:18px 22px;background:#fff7ed;border-left:3px solid #ea580c;border-radius:6px;font-size:0.92rem;color:#7c2d12;\"\u003e\n\u003cstrong\u003eDelivery — manual fulfillment.\u003c\/strong\u003e Once your payment clears, the WaveQuanta Intelligence team will email the full \u003cstrong\u003e106-page PDF\u003c\/strong\u003e to your billing email within \u003cstrong\u003eone business day\u003c\/strong\u003e. Single-licence — for use by the purchasing individual \/ team only. If you need a multi-seat or enterprise licence, contact us before ordering.\n\u003c\/div\u003e\n\n\u003cp style=\"margin-top:20px;font-size:0.85rem;color:#6b7280;text-align:center;\"\u003e\nPrice shown: \u003cstrong\u003eSGD 3,752\u003c\/strong\u003e · approximately \u003cstrong\u003eUSD $2,999\u003c\/strong\u003e at current rates.\n\u003c\/p\u003e\n\n\u003c\/div\u003e\n\u003cdiv style=\"margin-top:24px;padding:16px 20px;background:#f0fdf4;border-left:3px solid #16a34a;border-radius:6px;\"\u003e\n  \u003cstrong style=\"color:#14532d;display:block;margin-bottom:6px;\"\u003eEquipment Spotlight\u003c\/strong\u003e\n  \u003cp style=\"font-size:0.95rem;color:#374151;margin:6px 0 8px 0;line-height:1.6;\"\u003e\n    The report’s ultrafast-laser via-formation analysis is anchored to commercially-shipping LACE (Laser Accelerated Chemical Etching) platforms — see live \u003ca href=\"\/collections\/wq-drl-thruglas\" style=\"color:#16a34a;text-decoration:underline;font-weight:500;\"\u003eDR Laser ThruGlas wafer-level \u0026amp; panel-level TGV equipment\u003c\/a\u003e available for inquiry.\n  \u003c\/p\u003e\n\u003c\/div\u003e","brand":"WaveQuanta Intelligence","offers":[{"title":"Default Title","offer_id":48166423003290,"sku":"WQ-RPT-TGV-2026-05","price":3752.0,"currency_code":"SGD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0734\/6156\/3546\/files\/wq-tgv-report-cover_afb11f1b-fd8d-49d9-8240-e10f0e05ac8e.png?v=1780215968"}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0734\/6156\/3546\/collections\/wq-tgv-report-cover.png?v=1780215964","url":"https:\/\/waveqvanta.com\/collections\/wq-industry-reports.oembed","provider":"WaveQuanta","version":"1.0","type":"link"}