DR Laser
Kleave Series — Laser Wafer Dicing Platform
KLEAVEContact for pricing
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DR Laser · Semiconductor · Advanced Display · Production-scale equipment
Applications
- MEMS & Sensors (accelerometers, gyroscopes, pressure sensors)
- RF Devices & SAW Filters
- MiniLED / MicroLED & sapphire substrates
- Logic IC / HBM 2.5D advanced packaging
- Low-k & fragile material processing (GaAs, SiC)
- DBG, DAF, mold/resin package dicing
- Glass / silicon bonded wafer singulation
Technical Notes
- Track record: 5,000+ nanosecond laser equipment shipped; 2,000+ picosecond units shipped (DR Laser disclosure).
- Source: DR Laser Kleave Series brochure (2025, lite version). Download the brochure from the Documents tab for full details.
This is a quoted product. Pricing, lead time, and final configuration depend on substrate, throughput, and integration requirements. Use the Contact Sales button to start an RFQ — WaveQuanta acts as DR Laser's regional partner and will route your inquiry to the BD team in Singapore.
| Models | Kleave Series |
|---|---|
| Process Type | Internal Dicing / Surface Scribe & Grooving / Full Cut |
| Laser Source Architecture | FlexiCore — multi-engine: IR / Green / UV / DUV |
| Pulse Width Options | ns / ps / fs (ultrafast cold cutting) |
| Supported Substrates | Silicon · Sapphire · GaAs · SiC · Lithium Niobate · Lithium Tantalate · Glass |
| Beam Synchronization | SynchroCut — real-time vision + stage alignment, multi-street cutting |
| Autofocus | SmartFocus 3D — multi-axis wafer bow & thickness compensation |
| Vision Control | Precision Vision Suite — in-line groove width detection + warpage correction |
| Recipe & SPC Software | zwave — full versioning, lot/wafer linkage, Cpk/Ppk dashboards |
| Fab Integration | FabLink — SECS/GEM, OPC UA, REST APIs, multi-site tenancy, OIDC/SSO |
| Customization | Configurable; consult R&D team |
Track record: 5,000+ nanosecond laser equipment shipped; 2,000+ picosecond units shipped (DR Laser disclosure).
Source: DR Laser Kleave Series brochure (2025, lite version). Download the brochure from the Documents tab for full details.
Source: DR Laser manufacturer datasheet. Download the brochure (PDF) from the Documents tab for full details.
No CAD drawings available for this product.
Product Family: Industrial Laser Process Equipment (8 variants)
| Product | SKU | Size | Clear Aperture | Operating Wavelength | |
|---|---|---|---|---|---|
| Bump PTP™ — Laser Print-Transfer-Print Metallization Line |
BUMP-PTP
| — | — | — | Contact |
| ThruGlas INS-510 — Panel-Level Through-Hole Inspection |
TG-INS-510
| — | — | — | Contact |
| ThruGlas CE-510 — Panel-Level Wet Etching (TGV) |
TG-CE-510
| — | — | — | Contact |
| ThruGlas LA-510 — Panel-Level Laser Modification (TGV) |
TG-LA-510
| — | — | — | Contact |
| ThruGlas INS-300 — Wafer-Level Through-Hole Inspection |
TG-INS-300
| — | — | — | Contact |
| ThruGlas CE-300 — Wafer-Level Wet Etching (TGV) |
TG-CE-300
| — | — | — | Contact |
| ThruGlas LA-300 — Wafer-Level Laser Modification (TGV) |
TG-LA-300
| — | — | — | Contact |
| Kleave Series — Laser Wafer Dicing Platform Current |
KLEAVE
| — | — | — |