DR Laser
ThruGlas INS-300 — Wafer-Level Through-Hole Inspection
TG-INS-300Contact for pricing
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DR Laser · Semiconductor · Advanced Display · Production-scale equipment
Applications
- Built-in 100 % through-hole penetration yield verification for wafer-level TGV lines
- Pairs with ThruGlas LA-300 + CE-300 to complete the wafer-level LACE production line
Technical Notes
- Detailed inspection performance figures available on request — contact DR Laser BD for the in-depth equipment spec sheet.
This is a quoted product. Pricing, lead time, and final configuration depend on substrate, throughput, and integration requirements. Use the Contact Sales button to start an RFQ — WaveQuanta acts as DR Laser's regional partner and will route your inquiry to the BD team in Singapore.
Related Reading — Strategic Intelligence
Through-Glass Vias & Glass-Core Substrates — The Glass Interconnect Stack (2026 Report)
106-page deep-dive on the TGV technology chain, 60+ players across US/EU/Japan/Korea/China/Taiwan, reconciled market models, and an investment / partner / buy / pass framework — strategic context for evaluating ThruGlas equipment in your roadmap.
| Models | ThruGlas INS-300 |
|---|---|
| Process Level | Wafer-level (300 × 300 mm, up to 12-inch) |
| Function | 100 % through-hole penetration yield verification |
| Detection Method | Built-in vision-based through-hole inspection module |
| Substrate Size | 4″–12″ wafer & panel |
| Substrate Thickness | 0.1–1.1 mm |
| Substrate Materials | Quartz · Schott BF33 / AF32 · Corning EXG / SG3.4 |
| Quality Metrics Verified | Taper < 0.1° · Roughness Ra < 100 nm · Circularity > 95 % |
Detailed inspection performance figures available on request — contact DR Laser BD for the in-depth equipment spec sheet.
Source: DR Laser manufacturer datasheet. Download the brochure (PDF) from the Documents tab for full details.
No CAD drawings available for this product.
Product Family: TGV Micro-Drilling Equipment — ThruGlas Series (6 variants)
| Product | SKU | Size | Clear Aperture | Operating Wavelength | |
|---|---|---|---|---|---|
| ThruGlas INS-510 — Panel-Level Through-Hole Inspection |
TG-INS-510
| — | — | — | Contact |
| ThruGlas CE-510 — Panel-Level Wet Etching (TGV) |
TG-CE-510
| — | — | — | Contact |
| ThruGlas LA-510 — Panel-Level Laser Modification (TGV) |
TG-LA-510
| — | — | — | Contact |
| ThruGlas INS-300 — Wafer-Level Through-Hole Inspection Current |
TG-INS-300
| — | — | — | |
| ThruGlas CE-300 — Wafer-Level Wet Etching (TGV) |
TG-CE-300
| — | — | — | Contact |
| ThruGlas LA-300 — Wafer-Level Laser Modification (TGV) |
TG-LA-300
| — | — | — | Contact |