DR Laser
ThruGlas CE-300 — Wafer-Level Wet Etching (TGV)
TG-CE-300Contact for pricing
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RoHS
REACH
DR Laser · Semiconductor · Advanced Display · Production-scale equipment
Applications
- Wafer-level TGV chemical etching (LACE step 2)
- Glass interposers · Mini/Micro LED · 2.5D packaging
Technical Notes
- Operation flow: Load cassette → Vacuum operation & wetting → Single-chamber etching & QDR rinsing → FR ultrasonic cleaning → Heated N₂ drying → Unload.
- Chemistry developed in-house under DR Laser's LACE technology — optimised per substrate.
- Source: DR Laser ThruGlas brochure (2025). Custom configuration available.
This is a quoted product. Pricing, lead time, and final configuration depend on substrate, throughput, and integration requirements. Use the Contact Sales button to start an RFQ — WaveQuanta acts as DR Laser's regional partner and will route your inquiry to the BD team in Singapore.
Related Reading — Strategic Intelligence
Through-Glass Vias & Glass-Core Substrates — The Glass Interconnect Stack (2026 Report)
106-page deep-dive on the TGV technology chain, 60+ players across US/EU/Japan/Korea/China/Taiwan, reconciled market models, and an investment / partner / buy / pass framework — strategic context for evaluating ThruGlas equipment in your roadmap.
| Models | ThruGlas CE-300 |
|---|---|
| Process Level | Wafer-level wet etching |
| Substrate Material | Quartz / Schott BF33 / AF32 / Corning EXG / Corning SG3.4 |
| Substrate Size | 4″–12″ wafer / panel |
| Substrate Thickness | 0.1–1.1 mm |
| Loading / Unloading | 4″–12″ cassette, automated |
| Main Build | High-strength SUS304 frame; acid & alkali resistant PP cover |
| Operation Mode | Semi-automatic; up to 1000 sets of recipe |
| Etching Chamber | Circulation, overflow, automatic refilling (low-fluid level) |
| Wetting Module | Ultrasonic + Vacuum + Overflow |
| Rinsing Module | QDR: top-spray, base water submerge |
| FR Module | 80 / 120 kHz, adjustable power |
| Footprint (L×W×H) | 6000 × 2000 × 2200 mm (customisable on request) |
| Pass-line | 1000 ± 20 mm |
| Electrical | 3-phase 380 V, 50 Hz |
| Waste Discharge | Facility-connected, or independent tank storage |
| Discharge / Refill | Automatic mode available |
| Material Transfer | XYZ-axis mechanical arm module |
Operation flow: Load cassette → Vacuum operation & wetting → Single-chamber etching & QDR rinsing → FR ultrasonic cleaning → Heated N₂ drying → Unload.
Chemistry developed in-house under DR Laser's LACE technology — optimised per substrate.
Source: DR Laser ThruGlas brochure (2025). Custom configuration available.
Source: DR Laser manufacturer datasheet. Download the brochure (PDF) from the Documents tab for full details.
No CAD drawings available for this product.
dr-laser-thruglas-ce-300 — thruglas p18 bf33 micrographs
Product Family: TGV Micro-Drilling Equipment — ThruGlas Series (6 variants)
| Product | SKU | Size | Clear Aperture | Operating Wavelength | |
|---|---|---|---|---|---|
| ThruGlas INS-510 — Panel-Level Through-Hole Inspection |
TG-INS-510
| — | — | — | Contact |
| ThruGlas CE-510 — Panel-Level Wet Etching (TGV) |
TG-CE-510
| — | — | — | Contact |
| ThruGlas LA-510 — Panel-Level Laser Modification (TGV) |
TG-LA-510
| — | — | — | Contact |
| ThruGlas INS-300 — Wafer-Level Through-Hole Inspection |
TG-INS-300
| — | — | — | Contact |
| ThruGlas CE-300 — Wafer-Level Wet Etching (TGV) Current |
TG-CE-300
| — | — | — | |
| ThruGlas LA-300 — Wafer-Level Laser Modification (TGV) |
TG-LA-300
| — | — | — | Contact |