DR Laser
ThruGlas LA-300 — Wafer-Level Laser Modification (TGV)
TG-LA-300Contact for pricing
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RoHS
REACH
DR Laser · Semiconductor · Advanced Display · Production-scale equipment
Applications
- Glass interposers · Glass core substrates
- Mini/Micro LED
- 2.5D advanced packaging — LACE pre-step for TGV formation
Technical Notes
- Two-step LACE process: (1) ultrafast Bessel-beam modification → (2) wet etching (CE-300). Pair with ThruGlas CE-300 + INS-300 for full wafer-level TGV line.
- Capabilities (LACE): aspect ratio up to 100:1, taper < 0.1°, Ra < 100 nm, circularity > 95 %, 100 % through-hole detection.
- Source: DR Laser ThruGlas brochure (2025). Custom configurations available — consult R&D.
This is a quoted product. Pricing, lead time, and final configuration depend on substrate, throughput, and integration requirements. Use the Contact Sales button to start an RFQ — WaveQuanta acts as DR Laser's regional partner and will route your inquiry to the BD team in Singapore.
Related Reading — Strategic Intelligence
Through-Glass Vias & Glass-Core Substrates — The Glass Interconnect Stack (2026 Report)
106-page deep-dive on the TGV technology chain, 60+ players across US/EU/Japan/Korea/China/Taiwan, reconciled market models, and an investment / partner / buy / pass framework — strategic context for evaluating ThruGlas equipment in your roadmap.
| Models | ThruGlas LA-300 |
|---|---|
| Process Level | Wafer-level — 300×300 mm, up to 12-inch |
| Laser Source | Customised Ultrafast Laser (Bessel beam) |
| Substrate Size | 4″–12″ wafer & panel |
| Substrate Thickness | 0.1–1.1 mm |
| Loading / Unloading | 4″–12″ cassette, automated |
| Processing Method | Fixed laser + high-precision mechanical platform |
| Processing Speed | 800 mm/s |
| Positioning Accuracy | ≤ ±1 μm |
| Repeatability | ≤ ±0.75 μm |
| Pattern Placement Accuracy | ≤ ±3 μm (across 300 mm) |
| Footprint (L×W×H) | 2800 × 2300 × 2300 mm |
| Weight | ≤ 5 tons |
| Drawing File Format | DXF |
Two-step LACE process: (1) ultrafast Bessel-beam modification → (2) wet etching (CE-300). Pair with ThruGlas CE-300 + INS-300 for full wafer-level TGV line.
Capabilities (LACE): aspect ratio up to 100:1, taper < 0.1°, Ra < 100 nm, circularity > 95 %, 100 % through-hole detection.
Source: DR Laser ThruGlas brochure (2025). Custom configurations available — consult R&D.
Source: DR Laser manufacturer datasheet. Download the brochure (PDF) from the Documents tab for full details.
No CAD drawings available for this product.
dr-laser-thruglas-la-300 — thruglas p18 bf33 micrographs
Product Family: TGV Micro-Drilling Equipment — ThruGlas Series (6 variants)
| Product | SKU | Size | Clear Aperture | Operating Wavelength | |
|---|---|---|---|---|---|
| ThruGlas INS-510 — Panel-Level Through-Hole Inspection |
TG-INS-510
| — | — | — | Contact |
| ThruGlas CE-510 — Panel-Level Wet Etching (TGV) |
TG-CE-510
| — | — | — | Contact |
| ThruGlas LA-510 — Panel-Level Laser Modification (TGV) |
TG-LA-510
| — | — | — | Contact |
| ThruGlas INS-300 — Wafer-Level Through-Hole Inspection |
TG-INS-300
| — | — | — | Contact |
| ThruGlas CE-300 — Wafer-Level Wet Etching (TGV) |
TG-CE-300
| — | — | — | Contact |
| ThruGlas LA-300 — Wafer-Level Laser Modification (TGV) Current |
TG-LA-300
| — | — | — |