DR Laser
ThruGlas LA-510 — Panel-Level Laser Modification (TGV)
TG-LA-510Contact for pricing
Contact Sales
Design Tools
Photonics Calculators
Explore 49 free online calculators for photonics design
Unit Converters
Convert between wavelength, frequency, power, and more
View all 49 calculators →
RoHS
REACH
DR Laser · Semiconductor · Advanced Display · Production-scale equipment
Applications
- Panel-level glass interposers (up to 650 × 750 mm)
- Glass core substrates for advanced packaging
- Mini/Micro LED panel-level processing
- 3rd-gen semiconductor TGV (in development)
Technical Notes
- Specially designed large high-precision platform tracks motion in real time; fast-response control module enables accurate and efficient panel-level glass processing.
- Track record: 2024 — panel-level TGV shipped in Mainland China; 2025 — panel-level TGV order received in Taiwan (ship-out July 2025).
- Source: DR Laser ThruGlas brochure (2025).
This is a quoted product. Pricing, lead time, and final configuration depend on substrate, throughput, and integration requirements. Use the Contact Sales button to start an RFQ — WaveQuanta acts as DR Laser's regional partner and will route your inquiry to the BD team in Singapore.
Related Reading — Strategic Intelligence
Through-Glass Vias & Glass-Core Substrates — The Glass Interconnect Stack (2026 Report)
106-page deep-dive on the TGV technology chain, 60+ players across US/EU/Japan/Korea/China/Taiwan, reconciled market models, and an investment / partner / buy / pass framework — strategic context for evaluating ThruGlas equipment in your roadmap.
| Models | ThruGlas LA-510 |
|---|---|
| Process Level | Panel-level — ≤ 650 × 650 mm (frame supports up to 650 × 750 mm) |
| Laser Source | Customised ultrafast laser (Bessel beam) |
| Substrate Size | < 650 × 650 mm |
| Substrate Thickness | 0.1–1.1 mm |
| Loading / Unloading | Mechanical arm / FOUP |
| Processing Method | Laser + high-precision mechanical platform |
| Processing Speed | 1000 mm/s |
| Repeatability | ≤ ±1.5 μm |
| Accuracy | ≤ ±3 μm |
| Pattern Placement Variation | ≤ ±3 μm across 300 mm · ≤ ±5 μm across 600 mm |
| Footprint (L×W×H) | 3700 × 2500 × 2300 mm |
| Weight | ≤ 10 tons |
| Drawing File Format | DXF |
Specially designed large high-precision platform tracks motion in real time; fast-response control module enables accurate and efficient panel-level glass processing.
Track record: 2024 — panel-level TGV shipped in Mainland China; 2025 — panel-level TGV order received in Taiwan (ship-out July 2025).
Source: DR Laser ThruGlas brochure (2025).
Source: DR Laser manufacturer datasheet. Download the brochure (PDF) from the Documents tab for full details.
No CAD drawings available for this product.
dr-laser-thruglas-la-510 — thruglas p18 bf33 micrographs
Product Family: TGV Micro-Drilling Equipment — ThruGlas Series (6 variants)
| Product | SKU | Size | Clear Aperture | Operating Wavelength | |
|---|---|---|---|---|---|
| ThruGlas INS-510 — Panel-Level Through-Hole Inspection |
TG-INS-510
| — | — | — | Contact |
| ThruGlas CE-510 — Panel-Level Wet Etching (TGV) |
TG-CE-510
| — | — | — | Contact |
| ThruGlas LA-510 — Panel-Level Laser Modification (TGV) Current |
TG-LA-510
| — | — | — | |
| ThruGlas INS-300 — Wafer-Level Through-Hole Inspection |
TG-INS-300
| — | — | — | Contact |
| ThruGlas CE-300 — Wafer-Level Wet Etching (TGV) |
TG-CE-300
| — | — | — | Contact |
| ThruGlas LA-300 — Wafer-Level Laser Modification (TGV) |
TG-LA-300
| — | — | — | Contact |