Application · Industrial · Femtosecond

Industrial Femtosecond Micromachining

Cold-ablation processing of hard, brittle, and heat-sensitive materials — sapphire, diamond, ceramics, glass, polymers — with low HAZ and sub-micron precision.

Stuck choosing pulse width, wavelength, scanner, focusing optics for your material? WaveQuanta translates your part specification into a working femtosecond micromachining process kit.

Step 2 — Confirm the problem

Common project challenges

If any of these sound familiar, you're in the right place. WaveQuanta engineers have seen — and solved — every one of them.

1

Material processing window discovery

What pulse energy, rep rate, and overlap give you the best edge quality?

2

Wavelength + pulse-width selection

Fs vs ps; 1030 vs 515 vs 343 nm — different materials want different combinations.

3

Beam quality and focal control

Spot size at sample, depth of focus, M² requirements for sub-micron features.

4

Throughput vs quality trade-off

Bursts, GHz repetition rate, multi-spot — how to scale process speed without losing edge quality.

5

Real-time process monitoring

Catching drift before you scrap a panel.

6

Heat-affected zone (HAZ) control

Even fs lasers produce some HAZ at high rep rate / overlap.

7

Scanner and optics matching

Galvo + F-theta vs telecentric + XY stage for your part geometry.

8

Pilot-to-production scaling

1 part / hour to 1000 parts / hour without losing the recipe.

Step 3 — Understand the system

Typical system architecture

Most projects in this area follow a similar signal flow. Your specific architecture depends on resolution, throughput, and form-factor targets.

INDUSTRIAL FEMTOSECOND LASER

Sealed industrial fs source — 1030 / 515 / 343 nm, 20–500 W, with reliability for 24/7 operation.

BEAM DELIVERY OPTICS

Power control, polarization, beam shaping before the focusing optics.

BEAM EXPANDER

Match laser beam diameter to scanner aperture for diffraction-limited focusing.

F-THETA SCAN LENS

Telecentric or F-theta — chooses depth of focus, field size, and spot size.

GALVANOMETER SCANNER

High-speed beam steering — kHz scan speed, sub-µrad jitter.

Step 4 — Pick the modules

Recommended system modules

These are the building blocks. Each module is a category of products — pick the right brand and grade for your project stage below.

Step 5 — Match your project stage

Choose your project stage

Same modules, three configurations sized for where your project is today. Move up the tiers as you progress from research to validation to OEM.

Research Starter

Process feasibility / R&D

Bench-mounted process bench for a small set of parts. Validates the laser-material interaction window before you commit to a production tool.

  • Stock industrial fs laser · 1030 nm
  • Manual XY + galvo
  • F-theta lens, beam expander
  • Manual diagnostics
  • Microscope for offline inspection

BOM tier: $80k – $200k

OEM Production

Equipment OEM · 24/7 line

Sealed industrial system for an OEM tool, with full recipe export, SECS/GEM, and long-term supply.

  • Sealed industrial fs / ps laser
  • Closed-loop wavelength control
  • High-throughput galvo + telecentric
  • Integrated SECS/GEM
  • Full quality docs (CE / SEMI)
  • Long-term supply contract

BOM tier: $1M+ · contract

Step 9 — Common questions

Frequently asked questions

Quick answers to the questions our application engineers hear most often.

Femtosecond or picosecond — which for my material?

Sapphire / glass / ceramic: fs preferred for sub-µm chipping. Polymers: fs avoids melt zone. Metals: ps often sufficient and 5× cheaper. CFRP composites: fs strongly preferred to avoid fiber pullout.

How fast can I run a galvo scanner?

Mechanical galvos: 1–10 m/s scan speed, kHz line rate. Resonant scanners: 30+ kHz line rate, faster but smaller field. Polygon scanners for very high throughput. Match scanner speed to laser rep rate × spot pitch — running too fast leaves gaps; too slow loses throughput.

What HAZ should I expect with fs laser?

Pure cold ablation with fs has <1 µm HAZ. But at high rep rate (>1 MHz), thermal accumulation kicks in and HAZ grows. The sweet spot: 200–800 kHz rep rate for most industrial processes.

Can fs lasers replace mechanical cutting / drilling?

For sub-mm features in hard / brittle / heat-sensitive materials: yes, fs replaces mechanical with better edge quality, no tool wear, and design flexibility. For large bulk material removal: no, mechanical is still faster.

How do you handle thermal drift over 24h?

Three pillars: (1) sealed industrial laser (Yi-Laser HELIOS), (2) closed-loop power monitoring with AOM attenuation, (3) thermally controlled enclosure. Together they hold pulse energy ±1 % over 24 h.

Can WaveQuanta provide the full process recipe?

For Engineering Validation tier and above, yes — we run process qualification on your specific material samples and deliver a documented recipe (laser settings, scan strategy, focal trajectory).

What's the realistic system uptime?

Sealed industrial fs lasers (Yi-Laser HELIOS, Amplitude Tangor): >99 % uptime over 12 months. Including planned maintenance: ~95 % effective uptime. Lab-grade fs: lower (~90 %) but cheaper.

Long-term supply for OEM equipment makers?

Yi-Laser fs lasers and WaveQuanta optics modules support 5+ year supply contracts with batch-consistency reports. Standard for SEMI / medical OEM customers.

Step 10 — Engineering Review

Application Engineering Review

Tell us your application, current setup, and project context. A WaveQuanta application engineer will return initial recommendations within 1 business day.

  1. 1 Application
  2. 2 Current setup
  3. 3 Project & purchase

Tell us your application

What you want to measure, in plain words. We'll translate to optics.

Your current setup

What do you already have? Skip any field that doesn't apply.

Project & purchase context

Helps us decide whether to scope a starter kit, a full engineering review, or an OEM design-in.