Precilasers

1099nm Pulse laser

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1099nm Pulse laser Laser Stealth Dicing is a non-contact cutting technique that can cut semiconductor materials accurately and efficiently. The wafer Stealth Dicing laser introduced by Precilasers has achieved high quality stealth dicing on a variety of wafer materials. The infrared laser’s pulse width and waveform can be adjusted, also feature with pulse width and repetition rate be adjusted continuouly, to achieve accurate processing of the wafer.

Features

  • High Power Waveform Can
  • Be Edited Good Beam
  • Quality Pulse Width Adjustable
  • Repetion Rate Asjustable
ModelsFL-NSF-1099-20-QCW
Center Wavelength1099nm
Pulse Width100-800ns (adjustable)
Repetition Rate50-200kHz (adjustable)
Average Power15W / 20W / 30W
Beam Diameter3±0.2mm
Beam Divergence (full angle)<0.5mrad
Beam Circularity>95%
Beam QualityTEM00, M²<1.2
Polarizationlinear,>20dB
Power Stability<0.3% @3hours, RMS
WaveformGaussian/Square waveform
CoolingWater cooling
Cold Start<2 hours
Warm Start<15 minutes
Controller Size≤483mm x 422mm x 105mm
Laser Head Size≤68.5mm x 278mm x 46mm / ≤520mm x 200mm x 95mm
Chiller Size≤58cm x 29cm x 52cm
Laser Head Weight≤10kg / ≤15kg
Laser Controller Weight≤20kg
Chiller Weight≤25kg
Cable Length Between Laser Head And Controllerfiber length>2m
Operating Temperature (No condensing)15-35 °C (water cooling)
Power Supply100V-240V, AC, 50/60Hz
Power Consumption<200W / <250W
CommunicationRS422

Source: Precilasers manufacturer datasheet. Download the brochure (PDF) from the Documents tab for full details.

No CAD drawings available for this product.

Product Family: NIR Lasers (720-1100nm) (36 variants)

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